DOI: 10.3724/SP.J.1187.2013.00326

Journal of Electronic Measurement and Instrument (电子测量与仪器学报) 2013/27:4 PP.326-333

Fault-tolerant design of redundant bidirectional TSV on 3D NoC

On the 3D NoC (Network-on-Chip), if one of the two groups of unidirectional TSVs (Through-Silicon Vias) in the adjacent routers between the layers has fault, the data would not be transmitted through this channel. A Fault-tolerant design of a cluster-based 3D NoC added redundant bidirectional TSVs is presented. A group of extra bidirectional TSVs, which could be dynamically configured between the unidirectional TSVs,was added to replace either of them which is faulted. Whats more, in the trouble-free case, the bidirectional TSVs could be configured to help transmit data packets to achieve high-speed data transmission. The experimental results demonstrate that the average packet transmission latency decreases by 43.8% at lest compared with the reference when some TSVs are fault, and the reliability of the system is improved.

Key words:3D NoC,fault tolerant,redundant,bidirectional TSV

ReleaseDate:2014-07-21 17:01:43